Gas purification classification and production process

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　　Gas Purification Classification and Production ProcessSource: Suzhou Shengyu Gas Equipment Co., Ltd. Release Date: 2021.12.07

　　Gas Purification Classification and Production Process

　　There are many ways to classify special gases. For example, according to the chemical composition of the gas itself, they can be divided into seven categories: silicon-based, arsenic-based, phosphorus-based, boron-based, metal hydrides, halides, and metal hydrocarbyls. According to their role in integrated circuits, they can be divided into seven categories: dopant gases, epitaxial gases, ion implantation gases, gases for light-emitting diodes, etching gases, gases for chemical vapor deposition (CVD), and carrier diluent gases. At the same time, the above classifications overlap. For example, silicon tetrachloride (SiCl4) belongs to both silicon-based gases and epitaxial gases, and is also used in chemical vapor deposition (CVD).

　　The main production processes of special gases include gas synthesis, gas purification, gas mixing, cylinder treatment, gas filling, and gas analysis and testing. Gas synthesis is to obtain crude gas products through chemical reactions under specific conditions of pressure, temperature, and catalysts. Gas purification is to refine crude products into higher-purity products through distillation and adsorption.

　　What is purification?

　　Gas mixing is to mix two or more effective component gases in a specific proportion to obtain a multi-component uniformly distributed mixed gas.

　　Cylinder treatment is the process of treating the inside, inner wall surface, and appearance of the cylinder according to the nature and requirements of the carrier gas to ensure the stability of the product during storage and transportation. Gas filling refers to filling gas into cylinders and other pressure vessels through pressure difference; gas analysis and testing is the process of analyzing and testing the components of the gas.

　　In electronic special gases, impurities such as water vapor and oxygen easily form oxide films on the surface of semiconductors, affecting the service life of electronic devices, and particulate impurities will cause semiconductor short circuits and circuit damage.

　　With the continuous development of the semiconductor industry, the production accuracy of products is getting higher and higher. Taking integrated circuit manufacturing as an example, the line width has evolved from the initial millimeter level to the micrometer level and even the nanometer level, which has put forward higher requirements for the purity of electronic special gases used in semiconductor production.